At present, the electronic information industry has become the first pillar industry of the national economy. Driven by the huge demand of the electronic information industry, China's integrated circuit industry has rapidly heated up, creating a huge market for semiconductor integrated circuit special equipment. As a supporting technology for the manufacture of integrated circuits, integrated circuit production equipment has ushered in a good development opportunity.
    Since the reform and opening up, China's IC industry has received more and more attention. The state has formulated and implemented the "Seventh Five-Year Plan", "Eighth Five-Year Plan", "Ninth Five-Year Plan" and "Tenth Five-Year Plan" and organized and implemented the "908" and "909" ICs. Major projects have successively established a number of state-owned, Sino-foreign joint venture, and foreign-owned IC production lines. The construction and development of these production lines have enabled the rapid development of China's IC equipment.
At present, there are more than 60 production and research units for semiconductor special equipment in China, among which there are about 20 to 30 factories involved in integrated circuit production equipment, and hundreds of independent integrated circuit equipments have been independently developed. Diffusion furnace, rapid heat treatment equipment, cleaning machine, homogenizing development equipment and partial lithography equipment in the front-end process of the semiconductor equipment industry; test probes, dicing machines, printers, lead frame forming machines in the subsequent processes, Laminator and part of the mold; single crystal furnace, slicer, grinding and polishing machine, partial purification equipment and test equipment in material preparation have become increasingly mature.
    In terms of new product research and development, the 45th research of China Electronics Technology Group, the 8 inch wafer processing automatic slicer, automatic dicing machine, automatic probe test bench, 6-inch double-sided lithography machine as a key project to break through, and The development of 0.25mm and higher resolution lithography machines and the industrialization of 0.5 mm lithography machines are being carried out, and the industrialization base of post-packaging equipment is being implemented. The thick plastic exposure machine developed by the Institute of Optoelectronics of the Chinese Academy of Sciences for MEMS and other fields has been Forming a series of products, the 700 plant also launched new products such as flattened MRIE equipment, ultra-clean workbench, mass flow controller, etc., Sujing Group's “Ninth Five-Year” national key scientific and technological research project “Submicron integrated circuit production micro-environment system "Through the national acceptance, the 6-inch homogenizing development system developed by Northwest Machinery Factory has been unveiled at the exhibition. The Nanguang Machinery Factory and Beijing Instrument Factory have also launched new products for PVD and electron beam evaporation, and 6 developed by Lanxin Communication Equipment Group Co., Ltd. New products such as inch wafer grinder, polishing machine and chamfering machine have been put on the market. The MGP plastic mold developed by Tongling Sanjia Company has been adapted to the integrated circuit. Installation requirements, Guangzhou love SPCC company produces high and low temperature test equipment in recent years has also made good performance.
    In 2001, China’s semiconductor equipment sales amounted to 200 million yuan, and the domestic market share was about 3%. It is reported that the sales of domestic semiconductor equipment increased by more than one time in 2002, about 500 million yuan, and the domestic market share is about 5%. Among them, semiconductor material processing equipment and post-packaging equipment of 150 mm (6 inches) and below are the main growth points. . According to the equipment industry association, the domestic semiconductor equipment market will grow by more than 40% in 2003.
    Since 2000, there have been more than 10 integrated circuit production lines under construction, under construction and planning in China. The construction funds already invested are about 3 billion US dollars. It is estimated that more than 3 billion US dollars will be invested in the near future. The $6 billion in construction funding means more than $4 billion in investment in integrated circuit-specific equipment. However, in 2002, the total sales of domestic semiconductor equipment companies was only 500 million yuan. The limited market share in the domestic market has aroused the concern of relevant government departments and savvy people. It is seeking to develop domestic special equipment industry and take measures to capture the dominant position in the domestic market, and seek common development strategies to develop national industries.